TEL:
High density tungsten cooper alloy
Specifications:
|
GRADE |
CHEMICAL CONTENT |
DENSITY |
HARDNESS |
|
|
|
||
|
Cu |
IMPURITY ≤ |
W |
g/cm3 ≥ |
HB Kgf/mm2 ≥ |
μΩ.cm ≤ |
% ≥ |
MPa ≥ |
|
|
W50/Cu50 |
50±2.0 |
0.5 |
BAL |
11.85 |
115 |
3.2 |
54 |
-- |
|
W55/Cu45 |
45±2.0 |
0.5 |
BAL |
12.3 |
125 |
3.5 |
49 |
-- |
|
W60/Cu40 |
40±2.0 |
0.5 |
BAL |
12.75 |
140 |
3.7 |
47 |
-- |
|
W65/Cu35 |
35±2.0 |
0.5 |
BAL |
13.3 |
155 |
3.9 |
44 |
-- |
|
W70/Cu30 |
30±2.0 |
0.5 |
BAL |
13.8 |
175 |
4.1 |
42 |
790 |
|
W75/Cu25 |
25±2.0 |
0.5 |
BAL |
14.5 |
195 |
4.5 |
38 |
885 |
|
W80/Cu20 |
20±2.0 |
0.5 |
BAL |
15.15 |
220 |
5 |
34 |
980 |
|
W85/Cu15 |
15±2.0 |
0.5 |
BAL |
15.9 |
240 |
5.7 |
30 |
1080 |
|
W90/Cu10 |
10±2.0 |
0.5 |
BAL |
16.75 |
260 |
6.5 |
27 |
1160
|
Application of tungsten copper
Tungsten copper Alloy (W-Cu alloy) is the composite of tungsten and copper which own it excellent performance of tungsten and copper. It is used widely in such industries as engine, electric power, electron, metallurgy, spaceflight and aviation.
a. High Performance Material for Aerospace Industry
b. Vacuum contact materials
c. Electrodes for electrical discharge machining
d. Electronic packaging materials and heat sink material
TEL: